SUN - CSA C22.2 No. 250.13, Light Emitting Diode (LED) Equipment for Lighting Applications

Update Remark: Aligned impact test requirements for polymeric enclosures in damp locations. Clarification of Class 2 and LED Class 2 exemptions.

A unit intended for damp locations shall be

(a) subjected to the environmental tests specified in Clause 9.12 unless all live parts and traces on the printed wiring board are potted (see Clause 7.7) or conformal coated (see Clause 8.7.2); and

b) if provided with a polymeric enclosure, comply with the Polymeric Impact Test in Clause 16.41 of CSA C22.2 No. 250.0, using a preconditioning temperature of 0 ±2.0°C (32 ±3.6°F); and

(b) (c) eligible to be marked as suitable for damp or dry locations and not be provided with any information such as (e.g., markings, instructions, or illustrations) that implies or depicts wet use.

A circuit operating at Class 2 or LED Class 2 power levels (see Annex A) in which voltage levels are below those that present a risk of electric shock (see Clause 3) is not required to be subjected to Items (a) and (b) above.

Update Remark: Aligned weatherometer and impact test requirements for polymeric enclosures in wet locations. Clarification of Class 2 and LED Class 2 exemptions.

A unit intended for use in wet locations shall

(a) be subjected to the environmental tests specified in Clause 9.12 unless all live parts and traces on the printed wiring board are potted (see Clause 7.7) or conformal coated (see Clause 8.7.2);

(b) if provided with a polymeric enclosure, comply with the weatherometer test specified in of CAN/CSA-C22.2 No. 0.17 and with the Polymeric Impact Test in Clause 16.41 of CSA C22.2 No. 250.0, using a preconditioning temperature of minus 35.0 ±2.0°C (minus 31.0 ±3.6°F), and

(c) if provided with a polymeric enclosure, three samples shall comply with the physical abuse test specified in CAN/CSA-C22.2 No. 0.17, immediately after 3h conditioning at –35 ± 2.0 °C ambient temperature; and

(d)(c) be eligible to be marked as suitable for wet locations.

A circuit operating at Class 2 or LED Class 2 power levels (see Annex A) in which voltage levels are below those that present a risk of electric shock (see definition in Clause 3) is not required to be subjected to Items (a) and (b) above.

Update Remark: Updated requirements for soldered connections

Version 2012 (Old):

Soldered connections shall be mechanically secured before soldering or comply with at least one of the following acceptable methods:

1. wave soldered connection;
2. covered by two part epoxy or the equivalent;
3. a conductor passing through a hole on printed circuit board;
4. surface mount device (SMD) components and small components without integral leads are not required to be mechanically secured to the printed circuit board prior to soldering;
5. surface mounted connector receptacles and associated connectors with leads considered acceptable without being mechanically secure in applications where the lead wires are not subjected to movement after assembly;
6. the connection of a wire held rigidly in place without the use of solder to preclude any movement at the point of electrical connection; or
7. a connection in a Class 2 or LVLE circuit where detachment will not result in reduced spacings to circuit other than Class 2 or LVLE.

Note: A soldered connection supplied by a Class 2 or LVLE source does not require additional mechanical securement if detachment will not reduce spacings to non-Class 2 or non-LVLE circuits below the applicable required spacings specified in Clause 8.8.

Version 2014 (New):

Soldered connections to printed wiring boards shall be secured by one of the following methods:

1. a conductor passed through a hole and soldered on the opposite side;
2. a solder connection covered with epoxy, silicone rubber, or potting;
3. a surface mount connection with solder reflow;
4. a conductor held rigidly in place (without the use of solder) so as to preclude any movement at the point of electrical connection;
5. surface mount device (SMD) components and components without integral leads soldered to the printed wiring board. Surface mounted connector receptacles and associated connectors with leads are acceptable without additional mechanical securement where the lead wires are not subject to movement after assembly;
6. where supplied by a LED Class 2 Controlgear, solder alone is sufficient if detachment will not reduce spacings of electrical parts to non-LED Class 2 circuits below the applicable required spacings of Clause 8.8;
7. a wave-solder connection to a metal-clad printed-circuit board without any further mechanical security; and
8. any other method that offers mechanical securement of the connection before soldering.

Supply and load connections
Update Remark: Expanded to include requirements for conduit closure plugs, knockouts, and twist-outs

Conductive traces shall be bonded to the substrate for the minimum conductor width and maximum unpierced area as required by the adhesion requirements of Annex C. 

Notes: 

1. Printed wiring boards that are completely encased in potting compound may exceed their specified minimum conductor width or maximum unpierced area.
2. A printed wiring board connected within a Class 2 or LED Class 2 circuit need not comply when means (such as position, distance, or barrier) are provided to ensure that the limited energy traces cannot contact non-energy limited live parts should the traces become detached from the substrate.

Temperatures measured in the temperature test of Clause 9.3 shall be in compliance with Table 8. 

Note: A printed wiring board connected within a Class 2 or LED Class 2 circuit need not comply when means (suchas position, distance, or barrier) are provided to ensure that the limited energy traces cannot contact non-energy limited live parts should the traces become detached from the substrate.

The flammability rating of the printed circuit board shall be in accordance with the requirements of Clause C.2.2 and Clause C.2.3 of Annex C. 

Note: A circuit supplied by a Class 2 power source or LED Class 2 Controlgear need not comply.

Printed wiring boards for direct support of current carrying parts shall comply with the requirements of Clause 5.7.1.3 and Clause 5.7.1.4 of CSA C22.2 No. 250.0. 

Notes: 

1. A printed circuit board that contains only a Class 2 or LED Class 2 circuits need not comply.
2. A printed circuit board that is completely encased in potting compound need not comply.

 * There are no temperatures specified; the manufacturer's rated temperature of the material or component shall be used. 

† Unless the material is thermal-setting, the maximum potting-compound temperature, when corrected to a 40 °C ambient temperature, is 15 °C less than the softening point of the compound as determined by ASTM E28.

Note: Additions to existing requirements are underlined

The junction of the thermocouple shall be firmly secured with the point on the surface on which the temperature is to be measured. When radiation might affect thermocouple measurement of polymeric material, the junction of the thermocouple may be embedded within the material such that the thermocouple junction is shielded from direct optical radiation. The thermocouple shall consist of wires not larger than 24 AWG (0.21 mm2) and not smaller than 30 AWG (0.05 mm2). Thermocouples consisting of 30 AWG (0.05 mm2) iron and constantan (Type J) wires shall be used whenever a referee temperature measurement by thermocouples is necessary. Thermocouples consisting of chromel-alumel (Type K) or copper-constantan (Type T) wires may be used if it is determined that high-frequency operation results in eddy current heating of iron and constantan thermocouples.

Note: Additions to existing requirements are underlined

During each test, the grounding means, if provided, shall be connected to ground through a 3A non-time delay fuse, and the unit shall be draped on a softwood surface covered with white tissue paper and draped with a double layer of cheesecloth conforming to the outline of the unit. The white tissue paper shall be nominally 0.001 in (0.025 mm) thick, commonly used for gift wrapping. The cheesecloth shall be untreated cotton cloth running approximately 34 g/m2 (0.11 oz/ft2), with a thread count in the range of 10 – 13x9–12 threads/cm (25 – 33 x 22 – 30 threads/in). The unit shall be energized at rated input voltage and frequency. The supply circuit shall be connected in series with a 20 A branch circuit-rated fuse (time delay type), of which the characteristics are such that the fuse does not open in less than 12s when carrying 40 A.

Update Remark: Updated test procedure
Version 2012 (Old):

A cord-connected unit rated for a nominal 250 V or less supply shall be tested in accordance with this Clause. Leakage current shall not be more than

1. 0.5 MIU for a two-wire cord- and plug-connected unit;
2. 0.5 MIU for a three-wire (including grounding conductor) cord- and plug-connected portable unit; 
   and
3. 0.75 MIU for a three-wire (including grounding conductor) cord- and plug-connected stationary or fixed unit.

Version 2014 (New):

A unit connected to a branch circuit supply voltage shall be tested in accordance with Clause 9.7. Leakage current shall not be more than

1. 0.5 MIU for units connected to a supply voltage of 150 volts or less to ground; or
2. 0.75 MIU for units connected to a supply voltage of greater than 150 volts to ground.

Note: This test can be waived for a remotely-mounted unit connected and grounded via a fixed supply connection or if the unit is an integral part of an end-product luminaire with a fixed supply connection and the end-product standard for the luminaire does not require a leakage current measurement when the supply connection is fixed.